The FPA-6000AS4 scanner features a 0.85 NA, 4:1 projection lens with ultra-low aberrations due to Canon’s proprietary wavefront engineering process and the incorporation of some CaF2 lens material. With a dual chamber excimer laser light source the
system is capable of resolutions in the order of 80nm. A single stage design allows for an efficient use of cleanroom floorspace. The high precision wafer scan stage results in an overlay precision of less than 18nm while running at the very high scan speed of 500mm per second. The system also features a
highly intuitive user interface and a high degree of automation to make it a highly productive manufacturing tool. The FPA-6000AS4 is designed for leading edge volume manufacturing often in conjunction with Canon’s KrF scanners in a mix-and-match mode. When used with Canon’s i-line stepper systems that feature the same 26mm x 33mm exposure field, the user can
benefit from a highly cost effective combination of products. This system family can all be configured for both 300mm and 200mm wafers.
Specifications
FPA-6000AS4 | ArF (193nm) Scanner | Resolution | 80nm | NA | 0.85 – 0.55 (Automatically Variable) | Reticle Size | 6-inch (0.25-inch thickness) | Reduction Ratio | 4:1 | Field Size | 26mm x 33mm | Overlay Accuracy | Mean + 3 sigma < 18nm | Throughput | 140 wph (300mm)
170 wph (200mm) |
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