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Superior lens performance for a wide range of applications at NA 0.80 (0.80 ~ 0.55), boasting very low levels of distortion and wavefront RMS (10 m lambda) due to Canon’s in-house lens engineering expertise, all allowing for very low k 1 applications
on the FPA-5000ES4b. FPA-5000ES4b is fully automation ready for 300mm production, including reticle SMIF, and it offers outstanding mix-and-match capabilities with the FPA-5500iZ+ i-line Stepper and FPA-6000 ArF- / KrF-Series Scanners for excellent CoO. The ES4b offers increased wafer chuck flatness for improved focus accuracy. Overlay accuracy is =16nm (m+3 sigma). Process latitude is guaranteed by the highly efficient, flexible illuminator providing easy sigma adjustability and a wide variety of
illumination options. Increased illumination intensity (40,000w/m ²) and improved uniformity. High throughput (110 wph / 300mm or 160 wph / 200mm) is achieved through the high wafer stage scan speed of 350mm/ec., in combination with the powerful 40W excimer laser, and a shorter reticle change time.
Specifications
FPA-5000ES4b | KrF (248nm) Scanner | Resolution | 110nm | NA | 0.80 – 0.55 (Automatically Variable) | Reticle Size | 6-inch (0.25-inch thickness) | Reduction Ratio | 4:1 | Field Size | 26mm x 33mm | Overlay Accuracy | Mean + 3 sigma < 16nm | Throughput | 110 wph (300mm)
160 wph (200mm) |
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